| PART |
Description |
Maker |
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| PC845 |
High Sensitivity, High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| PC815 PC815-SERIES |
High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| GDZT2R5.1 |
2-pin ultra mini-mold type for high-density mounting(GMD2)
|
Rohm
|
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| ISP521-1 ISP521-1X ISP521-108 ISP521-2 ISP521-2X I |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
